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Mechanical properties of adhesives for bonding wood—
Published Date September 2013, Vol.45:32–41,doi:10.1016/j.ijadhadh.2013.03.013 Author
Frank Stoeckel a,c
Johannes Konnerth b,,
Wolfgang Gindl-Altmutter a,b
aKompetenzzentrum Holz GmbH—Wood K plus, Altenberger Strasse 69, A-4040 Linz, Austria
bInstitute of Wood Technology and Renewable Materials, Department of Material Science and Process Engineering, BOKU-University of Natural Resources and Life Sciences, Konrad Lorenz Strasse 24, A-3430 Tulln, Austria
cInstitute for Building Materials, Concrete Construction, Fire Protection and Organic and Wood-based Construction Materials, TU-Braunschweig, Hopfengarten 20, D-38102 Braunschweig, Germany
Accepted 11 March 2013. Available online 10 April 2013.
In this review the current state of the art on mechanical properties of pure wood adhesives is summarised and discussed. Conventionally, mechanical adhesive properties were characterised by means of macroscopic tensile or bending tests of ex-situ cured adhesive films. More recently, nanoindentation was also used to characterise such ex-situ specimens, but more importantly, this method allows the mechanical characterisation of adhesive bond lines in-situ. Mechanical tests reveal high variability between, but notably also within specific groups of adhesives. For example, the modulus of elasticity covers a wide range of more than two magnitudes ranging from 0.1 GPa up to 15 GPa. Significant differences in adhesive stiffness were observed for adhesives intended to be used for solid wood products compared to wood based composite adhesives, the latter showing higher modulus values. In addition to mechanical adhesive properties as such, factors possibly influencing adhesive performance such as temperature, humidity or ageing of the bonds are taken into consideration.