Wood decay hazard in Spain using the Scheffer index: proposal for an improvement

Published Date

First online: 30 March 2016

Title 

Wood decay hazard in Spain using the Scheffer index: proposal for an improvement

• Author 

• Juan Fernandez-Golfin 
• , Enrique Larrumbide
• , Antonio Ruano
• , Jorge Galvan
• , Maria Conde

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• Abstract 

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• Wood in outdoor conditions is prone to water uptake and release. The influence of wood temperature and moisture on the decay risk is substantial. Different climate indexes and mathematical models have been used to predict the decay risk, being one of the most well-known is the Scheffer index (SI). Scheffer index values (SI1) and modified Scheffer index values considering days with no rain but condensation (SI2) together with the risk of physical and dimensional degradation of wood (RDA) and the severity climate indexes (summer and winter) are calculated for 48 capitals of province in Spain. The relationships between the risk of physical degradation of the wood (RDA) and the climatic severity variables both for summer (SCSI) and winter (WCSI) are analyzed, and a model for predicting the RDA value from the SCSI and WCSI values is proposed. The analysis of the relationship between the Scheffer index (SI1) and SCSI and WCSI variables leads to the conclusion that the decay risk is fundamentally governed by summer climatic severity (SCSI) in coastal areas and by both variables (SCSI and WCSI) in inland areas, the relative insolation value being the variable with the most significant effect, both in summer and winter. The effect of condensations on the decay risk is also assessed, leading to the conclusion that the frequent presence of condensation is an aggravating factor and therefore, this meteorological variable should be considered when calculating the decay risk. A new equation for SI calculation considering the condensation effect, together with a new rating of risk, is also provided.

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• References 

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• For further details log on website :

• http://link.springer.com/article/10.1007/s00107-016-1036-z

Water absorption of untreated and thermally modified sapwood and heartwood of Pinus sylvestris L.

Published Date

First online: 16 April 2016

Title 

Water absorption of untreated and thermally modified sapwood and heartwood of Pinus sylvestris L.

• Author 

• Wolfram Scheiding 
• , Martin Direske
• , Mario Zauer

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• Abstract 

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• Water absorption coefficients of untreated and thermally modified Scots pine (Pinus sylvestris L.) were determined on sapwood and heartwood in longitudinal, radial and tangential direction. Thermal modification was performed under atmospheric pressure and saturated steam at 190 and 210 °C for 3 h. The capillary water uptake of untreated and thermally modified heartwood was lower in all anatomical directions compared to sapwood. The two investigated treatment intensities showed contrary results for capillary water uptake.

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• References 

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• For further details log on website :

• http://link.springer.com/article/10.1007/s00107-016-1044-z

Influence of process parameters on the bonding performance of wood adhesive based on thermally modified soy proteins

Published Date

First online: 19 February 2016

Title 

Influence of process parameters on the bonding performance of wood adhesive based on thermally modified soy proteins

• Author 

• Doroteja Vnučec 
• , Marica Mikuljan
• , Andreja Kutnar
• , Milan Šernek
• , Andreja Goršek

• 
  

• Abstract 

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• The adhesive bonding strength and water resistance of wood adhesive based on thermally modified soy protein isolate (SPI) were optimized by varying the SPI concentration, pressing temperature and pressing time. Commercial SPI was thermally modified in a vacuum chamber at 50 °C, and dispersions were prepared with SPI mass fractions of 9.09, 9.91, 10.71, 11.50, and 12.28 % in distilled water. The pH of the dispersions was adjusted to 10.0, then afterwards stirred at 50 °C for 2 h. The adhesive viscosity was measured. Effective penetration (EP) and tensile shear strength of beech wood specimens bonded under the same bonding conditions were determined (according to the European Standards EN 204 and EN 205). Adhesive with optimal SPI concentration was used for bonding at different pressing temperatures (100, 110, 120, 130, and 140 °C), whilst other bonding conditions were the same as by optimising SPI concentration. The optimal pressing temperature was determined based on tensile shear strength results. It was then used for bonding at different pressing times (6, 7, 8, 9, 10, 12, and 15 min). Optimal pressing time was determined based on tensile shear strength results. The viscosity of the adhesive increased with increased SPI concentration. The EP increased with increased viscosity and SPI mass fraction up to 11.50 % and then decreased. The adhesive with SPI mass fraction of 11.50 % showed the best water resistance. For this adhesive the optimal pressing temperature was 110 °C and optimal pressing time 10 min. The adhesive passed the durability class D3.

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• References 

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• http://link.springer.com/article/10.1007/s00107-016-1018-1