Analytical pyrolysis of waste paper laminated phenolic-printed circuit board (PLP-PCB)

Published Date
September 2015, Vol.115:87–95, doi:10.1016/j.jaap.2015.06.013

Author 

Young-Min Kim ^a,b,1

Tae Uk Han ^b,1

Chuichi Watanabe ^a

Norio Teramae ^a,c

Young-Kwon Park ^d

Seungdo Kim ^b,,

ByeongA Hwang ^b

aFrontier Laboratories Ltd., 1-8-14, Saikon, Koriyama, Fukushima 963-8862, Japan

bDepartment of Environmental Sciences and Biotechnology, Hallym University, 200-702 Chuncheon, South Korea

cDepartment of Chemistry, Graduate School of Science, Tohoku University, Aoba-ku, Sendai 980-8578, Japan

dSchool of Environmental Engineering, University of Seoul, Seoul 130-743, South Korea

Received 12 May 2015. Revised 17 June 2015. Accepted 27 June 2015. Available online 17 July 2015.

Highlights

• Paper laminated phenolic-printed circuit board (PLP-PCB) was pyrolyzed by TGA and Py-GC/MS.
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  Pyrolysis of PLP-PCB was consisted with four independent reactions and char stabilization reactions.
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  TPP, TIPPP, TBBA, and pyrolysis oil of laminated paper and phenol resin were produced by PLP-PCB pyrolysis.

Abstract 

The pyrolysis of a paper laminated phenolic-printed circuit board (PLP-PCB) was investigated. Kinetic analysis revealed the pyrolysis of PLP-PCB to be composed of a series reaction distinguished by the DTG curve and four activation energy regions: (1) vaporization of phosphorous flame retardants (<280 °C), (2) pyrolysis of laminated paper and tetrabromo bisphenol A (TBBA) (280–370 °C), (3) pyrolysis of phenolic resin (370–500 °C), and (4) stabilization of the char intermediate (>500 °C). The evolved gas analysis-mass spectrometry (EGA-MS) and heart cut EGA-gas chromatography (GC)/MS results showed that large amounts of phosphate flame retardants which can be reused as additives were recovered below 280 °C. Because the paper and TBBA had almost the same decomposition temperature regions, the pyrolyzates of laminated paper, mainly levoglucosan, were produced together with the pyrolyzates of TBBA, mainly brominated bisphenol between 280 and 370 °C. Important chemical feedstock, such as phenol, cresols and other alkylated phenols were produced from the decomposition of phenol resin between 370 and 500 °C, and aromatic compounds were emitted as the byproducts of char stabilization reaction at temperatures higher than 500 °C.

Keyword

Paper laminated phenolic-printed circuit board

Phosphorous flame retardants

TBBA

EGA-MS

Heart cut-EGA-GC/MS

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  Corresponding author. Fax: +82 33 241 1536.
  
  

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