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Gascón-Garrido, P., Mainusch, N., Militz, H. et al. Eur. J. Wood Prod. (2016). doi:10.1007/s00107-016-1121-3
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Atmospheric pressure plasma was used to deposit thin layers of copper and aluminium micro-particles on the surface of Scots pine sapwood (Pinus sylvestris L.) boards. Three different loadings of metal particles were established. Additional wood boards were topcoated with a commercial acrylic binder. Boards were exposed to natural weathering for 18 months. Discolouration of copper-treated boards was slowed down, and the treatment at highest loading displayed the best appearance. Aluminium treatment was not sufficient to prevent or reduce discolouration. The application of an acrylic binder as topcoating enhanced the general appearance of metal-treated boards. Evaluation of treated boards did not reveal any reduction in crack formation or water uptake due to the particle deposition. Infrared spectroscopy suggested that copper does not protect lignin from photo-degradation. Nevertheless, copper treatment reduced fungal infestation on wood; at highest copper loading, blue stain did not penetrate through the treated surface.
References
For further details log on website :
http://link.springer.com/article/10.1007/s00107-016-1127-x
Original
- First Online:
- 08 November 2016
DOI: 10.1007/s00107-016-1121-3
Author
Atmospheric pressure plasma was used to deposit thin layers of copper and aluminium micro-particles on the surface of Scots pine sapwood (Pinus sylvestris L.) boards. Three different loadings of metal particles were established. Additional wood boards were topcoated with a commercial acrylic binder. Boards were exposed to natural weathering for 18 months. Discolouration of copper-treated boards was slowed down, and the treatment at highest loading displayed the best appearance. Aluminium treatment was not sufficient to prevent or reduce discolouration. The application of an acrylic binder as topcoating enhanced the general appearance of metal-treated boards. Evaluation of treated boards did not reveal any reduction in crack formation or water uptake due to the particle deposition. Infrared spectroscopy suggested that copper does not protect lignin from photo-degradation. Nevertheless, copper treatment reduced fungal infestation on wood; at highest copper loading, blue stain did not penetrate through the treated surface.
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http://link.springer.com/article/10.1007/s00107-016-1127-x
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