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Friday 20 May 2016

Fungus-Modified Lignin and Its Use in Wood Adhesive for Manufacturing Wood Composites*

FOREST PRODUCTS JOURNAL ONLINE

Fungus-Modified Lignin and Its Use in Wood Adhesive for Manufacturing Wood Composites*

Yaolin ZhangDian-Qing YangXiang-Ming WangMartin Feng, and Guangbo He
The authors are, respectively, Chemist & Senior Scientist, Senior Scientist, and Principal Scientist, FPInnovations, Quebec, Quebec, Canada (yaolin.zhang@fpinnovations.ca [corresponding author], dian-qing.yang@fpinnovations.ca, xiang-ming.wang@fpinnovations.ca; and Principal Scientist and Scientist, FPInnovations, Vancouver, British Columbia, Canada (martin.feng@fpinnovations.ca, guangbo.he@fpinnovations.ca). This paper was received for publication in March 2014. Article no. 14‐00034.

* This article is part of a series of 10 selected articles addressing a theme of efficient use of wood resources in wood adhesive bonding research. The research reported in these articles was presented at the International Conference on Wood Adhesives, held on October 9–11, 2013, in Toronto, Canada. All 10 articles are published in this issue of the Forest Products Journal (Vol. 65, No. 1/2).
Abstract
Organosolv lignins were modified with different fungal species. The modified lignins were used as raw materials for preparing lignin-phenol-formaldehyde (LPF) resins. Oriented strandboard (OSB) panels were produced with these laboratory-synthesized LPF resins for evaluating the bond performance of the LPF resins in the manufacturing of wood composites. Ultraviolet spectroscopy results show that the phenolic hydroxyl contents in the lignins were changed after the lignins were treated with fungi. The lignin modified with the brown-rot fungi extended the gel time of the LPF resin compared with the corresponding unmodified lignin, while the lignin modified with the white-rot fungi shortened the gel time. The OSB test results show that the internal bond strength and the bending properties of the panels bonded with the LPF resins containing the modified lignin were comparable to or better than those of the panels bonded with the commercial phenolic resin or the LPF resin containing the unmodified lignin. It is worth noting that the fungi-modified lignin reduced the thickness swell and water absorption of the OSB panels, implying the water resistance of the LPF resins was improved with the fungi-modified lignin. It is also suggested that up to 50 percent of phenol can be potentially replaced with fungi-modified lignin in phenolic resins used as wood adhesives.

Cited by

Yusuf Celikbag and Brian K. Via. (2016) Characterization of Residue and Bio-Oil Produced by Liquefaction of Loblolly Pine at Different Reaction Times. Forest Products Journal 66:1-2, 29-36.
Online publication date: 30-Mar-2016.
Abstract | Full Text | PDF (394 KB) 

For further details log on website :

http://www.forestprodjournals.org/doi/abs/10.13073/FPJ-D-14-00034

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