KINETIC STUDY OF WC PARTICLES INCORPORATION IN NICKEL COMPOSITE PLATING

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Dae-Geun Kim and Jae-Ho Lee (jhlee@hongik.ac.kr)
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Surface Review and Letters (SRL), 2010, vol. 17, issue 03, pages 359-362

Abstract: The particles, suspended in the electrolyte, can be co-deposited with metal. The co-deposition behaviors of WC and Co-coated WC particles on nickel matrix were investigated. Many operating parameters that influence on the quantity of incorporated particles, including current density, bath agitation and electrolyte composition were investigated. The co-deposition of particles during electroplating depends on the rate of metal deposition and on the flux of particles to the film surface. The growth rate of the metal film is determined by the current density, whereas the flux of particles to the electrode surface is dependent on the particle size, particle concentration in solution, the electrode rotation rate, the particle diffusion coefficient, and the electrode geometry. The kinetic parameters in the co-deposition were calculated from the experimental results. Co-coated WC particles were easily incorporated in the matrix than WC particles from the calculated and experimental results.

Keywords: Composite plating; kinetics; WC; co-deposition (search for similar items in EconPapers)
Date: 2010
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