Author
For further details log on website :
http://www.sciencedirect.com/science/article/pii/S0168169916312145
YimingFangabLujunLinaHailinFengaZhixiongLubGrant W.Emmsc
- a
- School of Information Engineering, Zhejiang A & F University, Lin’an, China
- b
- College of Engineering, Nanjing Agricultural University, Nanjing, China
- c
- New Zealand Forest Research Institute Ltd., Rotorua, New Zealand
Received 22 December 2016, Revised 24 February 2017, Accepted 22 March 2017, Available online 4 April 2017.
Highlights
- •
- Wood property measurement and defect detection have been summarized.
- •
- ACU parameters are highly influenced by wood properties and defects.
- •
- Signal and image processing methods improve the quality of ACU signals or C-scan images.
- •
- Computer simulation and statistical methods aid to compensate for the background variation.
- •
- Imaging speed is an obstacle to industrial application.
Abstract
Air-coupled ultrasonic (ACU) is a contactless ultrasonic measurement method which has become increasingly popular for material characterization. This is due to a growing number of advanced materials which cannot be contaminated during the testing processes by coupling agents utilized in conventional ultrasonic testing. This paper provides a review of the applications of ACU to wood and wood products. The ACU fundamentals, including principles, working modes and commercial transducers used for this purpose, is briefly described. The emphasis of this paper is on approaches of inspection and characterization. The applications of ACU to wood characterization with reference to wood quality aspects are summarized. Correlations between the ACU parameters (i. e. amplitude, velocity, and spectrum) and the wood properties (i.e. density, moisture content, strength, and stiffness) as well as the wood defects (i. e. knots, cracks, decay, insect damage, and delamination) are dealt with in detail. Finally, a discussion of apparent future research directions completes this review.
http://www.sciencedirect.com/science/article/pii/S0168169916312145
No comments:
Post a Comment